A 3D simulation tool is needed to analyze the reactive injection molding process for thermoset materials. The typical applications include injection molding of unsaturated polyester, polyurethane, liquid silicone rubber, epoxy molding compound, etc. It is capable of simulating cavity filling and curing, cooling, part warpage, fiber orientation, multi-component process, etc.
A kinetics model of curing, especially for rubber, is supported. The incubation phase is described by the so-called scorch-index for user to determine vulcanization when the cavity is completely filled. Scorch-index predicts probable scorch sections during filling stage. After the scorch index reaches the value 1, the kinetics governed by curing reactive starts. In order to avoid scorch, a suitable injection time let the predicted scorch index smaller than 1 is required. A lower injection time generally leads to a smaller scorch index. In addition, the interactive relation between curing and part insert shift like wire-sweep phenomena in microchip encapsulation, shown in figure 2 and figure 3, can be easily revealed from analysis."
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